Meta has introduced specifications for a new Open Rack for AI featuring an Open Rack Wide (ORW) form factor, marking a major leap forward in open infrastructure innovation. Designed to meet the realities of AI-scale data centers, the ORW specification defines an open, double-wide rack optimized for the power, cooling, and serviceability demands of next generation AI systems. AMD is aligning with Meta and the Open Compute Project community in advancing this vision through “Helios”, its advanced rack-scale reference system from AMD, built fully on the ORW open standards.

Helios is purpose-built for frontier AI and HPC workloads, delivering up to 1.4 exaFLOPS FP8 performance and 31 TB of HBM4 memory in a single rack. It’s the first AMD rack-scale design engineered to meet the power, cooling, and interoperability demands of AI-scale data centers.

Built on open standards, Helios helps hyperscalers and   enterprises break free from proprietary infrastructure, accelerating innovation across the AI ecosystem.

“Open collaboration is key to scaling AI efficiently,” said Forrest Norrod, executive vice president and general manager, Data Center Solutions Group, AMD. “With ‘Helios,’ we’re turning open standards into real, deployable systems — combining AMD Instinct GPUs, EPYC CPUs, and open fabrics to give the industry a flexible, high-performance platform built for the next generation of AI workloads.”

As a reference design, “Helios” enables OEMs, ODMs, and hyperscalers to adopt, extend, and customize open AI systems quickly — reducing deployment time, improving interoperability, and supporting efficient scaling for AI and HPC workloads. The Helios platform reflects the ongoing collaboration from AMD across the OCP community to enable open, scalable infrastructure for AI deployments worldwide.